Sodium fluoride is an inorganic salt, which is an important source of the fluoride ion for many applications.
Formula and structure: The chemical formula of sodium fluoride is NaF and its molar mass is 41.99 g/mol. It is a simple ionic compound, made of the sodium (Na+) cation and fluoride (F-) anion. The solid salt exists as cubic crystals similar to the crystal structure of sodium chloride (NaCl).
Sodium fluoride occurs in nature as the rare mineral villiaumite, in very small quantities. Industrial production is the major source of sodium fluoride. It is commonly prepared by neutralizing hydrofluoric acid with bases such as sodium carbonate (soda ash, Na2CO3), sodium hydroxide (caustic soda, NaOH) or sodium bicarbonate (NaHCO3).
HF + NaOH → NaF + H2O
Magnesium sulfide represented by the chemical formula MgS that bears the IUPAC name sulfanylidenemagnesium is a white crystalline inorganic compound that is moderately soluble in water and acid . It is an ionic compound of magnesium and sulfer.
Formula and structure: The chemical formula of magnesium sulfide is MgS and its molar mass is 56.38 g /mol
Mg + S → MgS
Lithium Oxide is a highly insoluble thermally stable Lithium source suitable for glass, optic and ceramic applications. Lithium oxide is a white solid also known as lithia, it is produced when lithium metal burns in the presence of oxygen. Oxide compounds are not conductive to electricity. However, certain perovskite structured oxides are electronically conductive finding application in the cathode of solid oxide fuel cells and oxygen generation systems. They are compounds containing at least one oxygen anion and one metallic cation.
Formula and structure: The chemical formula of Lithium oxide is Li2O and its molar mass is 29.88 g /mol
4Li + O2 → 2Li2O
Iron (III) chloride, generically called ferric chloride, is the chemical compound with the formula FeCl3. The crystals appear a dark green colour by reflected light, but by transmitted light they appear purple-red as its colour depends upon the viewing angle. It is deliquescent, fuming in moist air due to the evolution of HCl, which hydrates, giving a mist. When dissolved in water, FeCl3 undergoes hydrolysis and gives off a great deal of heat as it is an exothermic reaction. The resulting brown, acidic solution, which is corrosive, is used as a coagulant in treating sewage and drinking water and as an etchant for copper-based metals ( such as those found in printed circuit boards ) and stainless steel.
Formula and structure:
The chemical formula of Iron ( III ) chloride is FeCl3 and its molar mass is 162.2 g /mol
2Fe + 3Cl3 → 2FeCl3
Formula and structure: The chemical formula of Copper ( II ) phosphide is Cu3P2, also known as Cupric Phosphide and its molar mass is 252.59 g/mol
Mg3P2 + 3Cu (C2H3O2)2 → Cu3P2 + 3Mg (C2H3O2)2
3CuO + 2PH3 → Cu3P2 + 3H2O
2Na3P + 3CuCl2 → Cu3P2 + 6NaCl
3CuS + 2AlP → Cu3P2 + Al2S3
3Cu + 2Ag3P → Cu3P2 + 6Ag
2PH3 + 3CuSO4 → Cu3P2 + 3H2SO4
Magnesium iodide is used in the deoxygenation of oxiranes to the corresponding alkenes via iodohydrins with retention of configuration in high yields and bridgehead triflates are converted into the corresponding iodides by reaction with MgI2. Magnesium Iodide is generally immediately available in most volumes. High purity, submicron and nanopowder forms may be considered. Iodide compounds are used in internal medicine. Treating an iodide with manganese dioxide and sulfuric acid sublimes the iodine.
Formula and structure: The chemical formula of Magnesium iodide is MgI2 and its molar mass is 278.1139 g /mol
Mg2+ + 2I → MgI2
Iron (II) phosphide is the chemical formula of of triiron diphosphide or ferrous phosphide. The Iron (II) phosphide or triiron diphosphide or ferrous phosphide can also be used as a semi-conductor.
Formula and structure: The chemical formula of Iron (II) phosphide or ferrous phosphide is Fe3P2 and its molar mass is 198.509 g /mol. Iron (II) means Fe2+ and Phosphide has a 3- charge. Now, if the charges are crossed the Iron ( II ) is formed as Fe3P2.
Aluminum Nitride, formula AlN, is a newer material in the technical ceramics family. While its discovery occurred over 100 years ago, it has been developed into a commercially viable product with controlled and reproducible properties within the last 20 years. The key properties of Aluminum nitride are as follows:
1) Good dielectric properties
2) High thermal conductivity
3) Low thermal expansion coefficient, close to that of Silicon
4) Non-reactive with normal semiconductor process chemicals and gases
Formula and structure: Aluminum nitride has a hexagonal crystal structure and is a covalent bonded material. The use of sintering aids and hot pressing is required to produce a dense technical grade material. The material is stable to very high temperatures in inert atmospheres. In air, surface oxidation begins above 700°C. A layer of aluminum oxide forms which protects the material up to 1370°C. Above this temperature bulk oxidation occurs. Aluminum nitride is stable in hydrogen and carbon dioxide atmospheres up to 980°C. The material dissolves slowly in mineral acids through grain boundary attack, and in strong alkalis through attack on the aluminum nitride grains. The material hydrolyzes slowly in water. Most current applications are in the electronics area where heat removal is important. This material is of interest as a non-toxic alternative to beryllia. Metallization methods are available to allow AlN to be used in place of alumina and BeO for many electronic applications.
The chemical formula of Aluminum nitride is AlN and its molar mass is 40.9882 g /mol
2Al + N2 → 2AlN
Al2O3 + 3C + N2 → 2AlN + 3CO
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