Task:
1. Report the view factors between all surfaces (heater, front of the wafer, back of the wafer, surrounding processing chamber).2. Draw and label the radiation resistance network. At the start of the RTP cycle (i.e. when the wafer is still at 300 K), 3. Calculate the net radiative heat transfer to/from the heater, the silicon wafer, and the surrounding chamber walls. • As part of this, please include all development work such as equations/calculations for radiation resistances, system o...
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